Technical Program Committee Chair : David Gesbert (Eurecom, F) Technical Program Committee Co-chair Helmut Boelcskei (ETHZ, CH) Technical Program Committee| K. Abed Meraim ENST Paris, F N. Al-Dhahir UT Dallas, USA S. Barbarossa U. of Rome, I E. Biglieri Politecnico Torino, I H. Boche Heinrich-Hertz IT, G J.-P. Delmas INT, France L. Deneire I3S-UNSA, F P. Duhamel Supelec, France H. El Gamal Ohio SU, USA J.R. Fonollosa UPC, Spain M. Ghogho U Leeds, UK G. Giannakis U Minnesota, USA A. Goldsmith Stanford U., USA F. Hlawatsch Vienna UT, AT R.W. Heath Jr. UT Austin, USA Yingbo Hua UC Riverside, USA V. Koivunen HUT, Finland G. Leus TU Delft, NL Ph. Loubaton U of Marne-la-Vallee, F J.H. Manton U Melbourne, AU M. Moonen KUL, Belgium | - B. Ottersten KTH, Sweden
- G. Oien NTNU, Norway
- C. Papadias Lucent Tech., USA
- A. Perez CTTC Spain
- S.-M. Phoong NTU, Taiwan
- V. Poor Princeton, USA
- B. D. Rao UCSD, USA
- P.A. Regalia CUA, USA
- B.M. Sadler ARL, USA
- A.H. Sayed UCLA, USA
- A. Scaglione Cornell U, USA
- P. Schniter Ohio SU, USA
- N. Sidiropoulos TU Crete, Greece
- L. Tong Cornell U, USA
- M.K. Tsatsanis Aktino Inc., USA
- A. Swami ARL, USA
- L. Vandendorpe UCL, Belgium
- A.-J. van der Veen TU Delft, NL
- G. Vazquez UPC, Spain
- X. Wang Columbia U, USA
- G. Wornell, MIT, USA
- X.-G. Xia U Delaware, USA
- Z. (Daniel) Xu UC Riverside, USA
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